Intel® Celeron® Processor up to 1.10 GHz Datasheet s s s s s s s Available at 1.10 GHz, 1 GHz, 950 MHz, 900 MHz, 850 MHz, 800 MHz, 766 MHz, 733 MHz, 700 MHz, 667 MHz, 633 MHz, 600 MHz, 566 MHz, 533 MHz, 533A MHz, 500 MHz, 466 MHz, 433 MHz, 400 MHz, 366 MHz, 333 MHz, and 300A MHz core frequencies with 128 KB level-two cache (on die); 300 MHz and 266 MHz core frequencies without level-two cache. Intel's latest Celeron® processors in the FC-PGA/FC-PGA2 package are manufactured using the advanced 0.18 micron technology. Binary compatible with applications running on previous members of the Intel microprocessor line. Dynamic execution microarchitecture. Operates on a 100/66 MHz, transactionoriented system bus. Specifically designed for uni-processor based Value PC systems, with the capabilities of MMXTM technology. Power Management capabilities. s s s s Optimized for 32-bit applications running on advanced 32-bit operating systems. Uses cost-effective packaging technology. -- Single Edge Processor (S.E.P.) Package to maintain compatibility with SC242 (processor core frequencies (MHz): 266, 300, 300A, 333, 366, 400, 433). -- Plastic Pin Grid Array (PPGA) Package (processor core frequencies (MHz): 300A, 333, 366, 400, 433, 466, 500, 533). -- Flip-Chip Pin Grid Array (FC-PGA / FC-PGA2) Package (processor core frequencies (MHz); 533A, 566, 600, 633, 667, 700, 733, 766, 800, 850, 900, 950); (GHz); 1, 1.10 Integrated high-performance 32 KB instruction and data, nonblocking, levelone cache: separate 16 KB instruction and 16 KB data caches. Integrated thermal diode. The Intel® Celeron® processor is designed for uni-processor based Value PC desktops and is binary compatible with previous generation Intel architecture processors. The Celeron processor provides good performance for applications running on advanced operating systems such as Microsoft* Windows*98, Windows NT*, Windows* 2000, Windows XP* and Linux*. This is achieved by integrating the best attributes of Intel processors--the dynamic execution performance of the P6 microarchitecture plus the capabilities of MMXTM technology--bringing a balanced level of performance to the Value PC market segment. The Celeron processor offers the dependability you would expect from Intel at an exceptional value. Systems based on Celeron processors also include the latest features to simplify system management and lower the cost of ownership for small business and home environments. FC-PGA2 Package FC-PGA Package PPGA Package S.E.P. Package Document Number: 243658-020 January 2002 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Celeron® processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com. Intel, Celeron, Pentium, MMX and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright© 1996­2002, Intel Corporation Datasheet Intel® Celeron® Processor up to 1.10 GHz Contents 1.0 Introduction.......................................................................................................................11 1.1 Terminology.........................................................................................................11 1.1.1 Package Terminology.............................................................................12 1.1.2 Processor Naming Convention...............................................................13 References ..........................................................................................................14 System Bus and Vref...........................................................................................15 Clock Control and Low Power States..................................................................15 2.2.1 Normal State--State 1 ...........................................................................16 2.2.2 AutoHALT Power Down State--State 2 .................................................16 2.2.3 Stop-Grant State--State 3 .....................................................................17 2.2.4 HALT/Grant Snoop State--State 4 ........................................................17 2.2.5 Sleep State--State 5..............................................................................17 2.2.6 Deep Sleep State--State 6 ....................................................................18 2.2.7 Clock Control..........................................................................................18 Power and Ground Pins ......................................................................................18 2.3.1 Phase Lock Loop (PLL) Power...............................................................19 Processor Decoupling .........................................................................................19 2.4.1 System Bus AGTL+ Decoupling.............................................................19 Voltage Identification ...........................................................................................20 System Bus Unused Pins....................................................................................21 Processor System Bus Signal Groups ................................................................21 2.7.1 Asynchronous Vs. Synchronous for System Bus Signals ......................23 2.7.2 System Bus Frequency Select Signal (BSEL[1:0]).................................23 Test Access Port (TAP) Connection....................................................................23 Maximum Ratings................................................................................................23 Processor DC Specifications...............................................................................24 AGTL+ System Bus Specifications .....................................................................33 System Bus AC Specifications ............................................................................34 System Bus Clock (BCLK) Signal Quality Specifications and Measurement Guidelines ....................................................................................52 AGTL+ Signal Quality Specifications and Measurement Guidelines ..................55 Non-AGTL+ Signal Quality Specifications and Measurement Guidelines...........57 3.3.1 Overshoot/Undershoot Guidelines .........................................................57 3.3.2 Ringback Specification ...........................................................................58 3.3.3 Settling Limit Guideline...........................................................................59 AGTL+ Signal Quality Specifications and Measurement Guidelines (FC-PGA/FC-PGA2 Packages) ...........................................................................59 3.4.1 Overshoot/Undershoot Guidelines (FC-PGA/FC-PGA2 Packages) .......59 3.4.2 Overshoot/Undershoot Magnitude (FC-PGA/FC-PGA2 Packages) .......59 3.4.3 Overshoot/Undershoot Pulse Duration (FC-PGA/FC-PGA2 Packages) ..............................................................................................60 3.4.4 Activity Factor (FC-PGA/FC-PGA2 Packages) ......................................60 1.2 2.0 2.1 2.2 Electrical Specifications....................................................................................................15 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 3.0 3.1 3.2 3.3 System Bus Signal Simulations........................................................................................52 3.4 Datasheet 3 Intel® Celeron® Processor up to 1.10 GHz 3.5 4.0 4.1 5.0 Reading Overshoot/Undershoot Specification Tables (FC-PGA/FC-PGA2 Packages) .............................................................. 61 3.4.6 Determining if a System meets the Overshoot/Undershoot Specifications (FC-PGA/FC-PGA2 Packages)....................................... 62 Non-AGTL+ Signal Quality Specifications and Measurement Guidelines........... 64 Thermal Specifications........................................................................................ 65 4.1.1 Thermal Diode........................................................................................ 68 S.E.P. Package ................................................................................................... 69 5.1.1 Materials Information.............................................................................. 69 5.1.2 Signal Listing (S.E.P. Package) ............................................................ 70 PPGA Package ................................................................................................... 79 5.2.1 PPGA Package Materials Information.................................................... 79 5.2.2 PPGA Package Signal Listing ................................................................ 81 FC-PGA/FC-PGA2 Packages ............................................................................. 92 5.3.1 FC-PGA Mechanical Specifications ....................................................... 92 5.3.2 Mechanical Specifications (FC-PGA2 Package) .................................... 94 5.3.2.1 Recommended Mechanical Keep-Out Zones (FC-PGA2 Package) ................................................................. 96 5.3.3 FC-PGA/FC-PGA2 Package Signal List................................................. 97 Processor Markings (PPGA/FC-PGA/FC-PGA2 Packages) ............................. 108 Heatsink Volumetric Keepout Zone Guidelines................................................. 109 Mechanical Specifications for the Boxed Intel® Celeron® Processor ................ 110 6.1.1 Mechanical Specifications for the S.E.P. Package............................... 110 6.1.1.1 Boxed Processor Heatsink Weight.......................................... 112 6.1.1.2 Boxed Processor Retention Mechanism ................................. 112 6.1.2 Mechanical Specifications for the PPGA Package............................... 113 6.1.2.1 Boxed Processor Heatsink Weight.......................................... 114 6.1.3 Mechanical Specifications for the FC-PGA/FC-PGA2 Packages......... 114 6.1.3.1 Boxed Processor Heatsink Weight.......................................... 115 Thermal Specifications...................................................................................... 115 6.2.1 Thermal Requirements for the Boxed Intel® Celeron® Processor........ 115 6.2.1.1 Boxed Processor Cooling Requirements ................................ 115 6.2.1.2 Boxed Processor Thermal Cooling Solution Clip .................... 117 Electrical Requirements for the Boxed Intel® Celeron® Processor ................... 117 6.3.1 Electrical Requirements ....................................................................... 117 Signal Summaries ............................................................................................. 126 3.4.5 Thermal Specifications and Design Considerations......................................................... 65 Mechanical Specifications................................................................................................ 69 5.1 5.2 5.3 5.4 5.5 6.0 6.1 Boxed Processor Specifications..................................................................................... 110 6.2 6.3 7.0 Processor Signal Description ......................................................................................... 120 7.1 4 Datasheet Intel® Celeron ...