Material Composition Declaration © Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under both international and Pan-American copyright conventions. This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has engineering responsibility. Adobe Reader version 7.0.5 is required to complete this declaration. 1.0 IPC-1752-1 v1.02 unLock IPC Web Site for Information on IPC-1752 Standard http://www.ipc.org/IPC-175x 1752-1 Form Type * Distribute Declaration Class * Class 1 - RoHS Yes/No Supplier Information Company Name * Company Unique ID Title - Contact CTO Unique ID Authority Phone - Contact * 510 222 0131 Response Date * Response Document ID Keyspan Contact Name * Eric Welch Same Requester Item Number Mfr Item Number Mfr Item Name August 2006 Email - Contact * eric@keyspan.com Duplicate Contact -> Authorized Representative Authorized Representative * Title - Representative Phone - Representative * Email - Representative * Effective Date Version Supplier Comments or URL for Additional Information Weight UOM Unit Type Manufacturing Site AV-DK1W and AV-DK1B Alternate Recommendation AV Dock for iPod April 2006 China Alternate Item Comments mg Each Manufacturing Information section intentionally omitted. * Required Field CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe Save the fields in this form to a file Export Data Import fields from a file into this form Import Data Clear all of the fields on this form Reset Form Lock the fields on this form to prevent changes Declaration Type * Lock Supplier Fields Simplified RoHS Material Composition Declaration 2002/95/EC RoHS Directive RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium Supplier certifies that it gathered the information it provides in this form concerning RoHS restrictive substances using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part, and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part,the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form. RoHS Declaration * 1 - Item(s) does not contain RoHS restricted substances per the definition above Supplier Acceptance Accepted Exemptions: If the declared item does not contain RoHS restricted substances per the definition above except for defined RoHS exemptions, then select the corresponding response in the RoHS Declaration above and checkboxes will appear below. Check all applicable exemptions. 1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp. 2a. Mercury in straight fluorescent lamps for general purposes not exceeding 10 mg. in halophosphate lamps 2b. Mercury in straight fluorescent lamps for general purposes not exceeding 5 mg. in triphosphate lamps with a normal lifetime 2c. Mercury in straight fluorescent lamps for general purposes not exceeding 8 mg. in triphosphate lamps with long lifetime 3. Mercury in straight fluorescent lamps for special purposes. 4. Mercury in other lamps not specifically mentioned in this list. 5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. 6a. Lead as an alloying element in steel containing up to 0.35% lead by weight. 6b. Lead as an alloying element in aluminum containing up to 0.4% lead by weight. 6c. Lead as an alloying element in copper containing up to 4% lead by weight. 7a. Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by weight or more lead). 7b. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications. 7c. Lead in electronic ceramic parts (e.g. piezoelectronic devices). 8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations piezoelectronic devices). 9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators 10a. Deca BDE in polymeric applications 10b. Lead in lead/bronze bearing shells and bushes 11. Lead used in compliant pin connector systems. 12. Lead as a coating material for a thermal conduction module c-ring. 13a. Lead in optical and filter glass. 13b. Cadmium in optical and filter glass. 14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight . 15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. Declaration Signature Instructions: Complete all of the required fields on all pages of this form. Select the "Accepted" on the Supplier Acceptance drop-down. This will display the signature area. Digitally sign the declaration (if required by the Requester) and click on Submit Form to have the form returned to the Requester. Supplier Digital Signature Eric Welch Digitally signed by Eric Welch DN: cn=Eric Welch, c=US, o=InnoSys Inc, ou=Keyspan Date: 2006.09.08 14:18:17 -07'00' * Required Field CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe JIG section intentially omitted. * Required Field CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe